|
|
WPL Board Size 560mm x 640mm |
|
|
|
Finish Thickness 0.3~3.5mm |
|
|
|
PCB Layer Count 2~16 Layers |
|
|
|
Finish Copper HOZ~6OZ |
|
|
|
Aspect Ratio 10:1 |
|
|
|
Impedance Requirement 90~100±10% |
|
|
|
the Tolerance of Board Thickness ±10% |
|
|
|
Min Finish Hole 0.15mm 、Laser 0.075mm |
|
|
|
Hole Position Alignment Extent ±2mil |
|
|
|
Min Trace / Gap of inner layer/ Gap of inner layer 3/3mil |
|
|
|
Min Trace / Gap of outer layer 3/3mil |
|
|
|
Min Ring size 4mil |
|
|
|
Min. S/M Opening ( One Sided ) 2mil |
|
|
|
Min Solder Bridge Design 2mil |
|
|
|
Plug Hole Size ≦0.7mm |
|
|
|
Thickness of Gold Plating 2 ~ 40μ" |
|
|
|
the thickness of immersion Gold 2~8u" |
|
|
|
Width/Height of Silkscreen 5mil/25mil |
|
|
|
the Tolerance of CNC/PUNCH ±0.1mm |
|
|
|
O/S Test Conditon 50-300V、1MΩ-100MΩ |
|
|
|
CAM Operation System Orbotech Genesis、CAM350 |
|
|
|
surface finish ENIG Immersion Silver Immersion TinHASL OSP, Gold Finger etc |
|
|
|
Base Material CEM-3、FR-4、HF、High Tg、Al laminate、copper laminate、Teflon,etc |